Smith to showcase supply chain approach at embedded world North America

Smith will exhibit at embedded world North America in Anaheim from Sept. 22-24, where the electronic components distributor plans to highlight its supply chain capabilities and connect with partners. The appearance comes as procurement teams face market pressure and demand for critical chips remains high.

Why it matters: - Smith is using embedded world North America to market its supply chain capabilities to the embedded systems audience. - The show gives Smith a chance to meet current and prospective partners while demand for electronic components remains volatile. - The event matters for procurement teams that need access to critical chips and dependable sourcing support.

What happened: - Smith said it will exhibit at embedded world North America in Anaheim, California, from Tuesday, Sept. 22, through Thursday, Sept. 24. - The company will be at Exhibit Hall B, Booth 6426 at the Anaheim Convention Center, 200 S. Anaheim Blvd., Anaheim, CA 92805. - Smith said this will be its second time exhibiting at the show.

The details: - Smith plans to highlight its approach to navigating complex market conditions and procuring critical components for customers. - The company will present its Intelligent Distribution™ model and its global reach as part of its sales pitch to partners. - Smith said its solutions are designed to be customizable and comprehensive for different partner needs. - Todd Burke, Smith’s chief commercial officer, said procurement professionals are under strain from current market conditions and that the company’s team can help secure chips needed for next-generation technologies. - The conference is positioned as a major embedded-tech gathering for leaders across the electronics industry.

Between the lines: - Smith is leaning on its supply chain expertise as a differentiator, not just its distribution footprint. - The timing suggests the company sees embedded world North America as a high-value venue for business development in a market shaped by AI-driven demand for semiconductors. - Smith is signaling reliability and scale as competitive advantages while competing for attention in a crowded component distribution market.

What's next: - Smith representatives will meet attendees during the Sept. 22-24 event. - The company is likely to use the conference to deepen relationships and generate new customer leads. - More information is available in Smith’s announcement.